S804-190R-245

The Kings Peak Series

Elliptical Pin Heat Sink with Push Pins

19 X 19 X 24.5 mm

 

Features and Benefits

  • Designed for medium- to high-airflow environment (200-1000 LFM, or 1.0-5.0 m/sec)
  • Forged from highly conductive pure aluminum (240 W/m-K)
  • Secure attachment to PCB using push pins or shoulder screws
  • Low pressure drop (improving downstream velocity and temperature fields)
  • Overall height can be customized (without increasing cost)
  • Secondary operation available (to modify shape, add holes, eliminate or shorten certain pins, etc.)
  • RoHS compliant
  • Cost effective
S804-190R-245 Elliptical Pin Heat Sink with Push Pins

Mechanical Drawing

Mechanical Drawing of Elliptical Pin Heat Sink with Push Pins

Thermal Performance Curve

Thermal Performance of Elliptical Pin Heat Sink with Push Pins

Mechanical and Thermal Specs

PropertyValueUnit
Width19.0mm
Length19.0mm
Height24.5mm
Weight7.8g
θSA (natural)12.91°C/W
θSA (200 LFM)4.56°C/W
θSA (400 LFM)3.46°C/W
θSA (600 LFM)2.74°C/W
θSA (800 LFM)2.45°C/W

Thermal Interface Material and Attachment Hardware

  • We recommend using spring-loaded push pins or shoulder screws to secure the heat sink to device.
  • We recommend Chomerics T725, T557 or Laird Tpcm 585 as interface materials.
What is the thermal resistance (θSA)?
Airflow rate:
What will be the base temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
What will be the junction temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
TIM impedance:
θjc: °C/W
* The computation is based on the interpolation of experimental or simulation data, and the result is for reference only.
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